100% material declaration data sheet CS144 pk149 (v1.2) september 28, 2006 ma terial declaration data sheet average weight: 0.3 g component substance description cas# or description % of component use in product component weight/ substance weight (in grams) component % of total silicon die 0.01818 6.06% silicon 7440-21-3 100.00 0.01818 die attach material 0.00099 0.33% silver 7440-22-4 52.00 0.0005148 resin (ep) trade secret 48.00 0.0004752 encapsulant 0.15591 51.97% epoxy resins trade secret 6.00 0.0093546 phenolic resins trade secret 6.00 0.0093546 carbon black 1333-86-4 0.50 color 0.00077955 silica 60676-86-0 84.00 0.1309644 bismuth 7440-69-9 max 1.00 0.0015591 metal hydroxide trade secret 2.50 0.00389775 tape 0.01794 5.98% polymide trade secret 41.51 0.007446894 adhesive trade secret 58.49 0.010493106 metal layers 0.03285 10.95% copper 7440-50-8 88.32 0.02901312 nickel 7440-02-0 7.90 0.00259515 gold 7440-57-5 3.78 0.00124173 bond wire 0.00261 0.87% gold 7440-57-5 100.00 0.00261 solder balls 0.07152 23.84% tin 7440-31-5 63.00 0.0450576 lead 7439-92-1 37.00 0.0264624 pk149 (v1.2) september 28, 2006 www.xilinx.com 1 ? 2006 xilinx, inc. all rights reserved. a ll xilinx trademarks, registered trademarks, patents, and di sclaimers are as listed a t http://www.xilinx.com/legal.htm . all other trademarks and registered trademarks are the property of their respective owners. all specifications are subject to c hange without notice. xilinx believes this environmental information to be correct, but cannot guarantee its completeness or accuracy as it is based on data received from sources outside our company.
100% material declaration data sheet ? CS144 2 www.xilinx.com revision history the following table shows the revi sion history for this document. date revision revision 4/06/06 1.0 initial release. 7/21/06 1.1 100% material declaration. 9/28/06 1.2 updated component descriptions. pk149 (v1.2) september 28, 2006
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